Phytium
Selection review for DDR, LPDDR, boot storage and peripheral interfaces on FT2000, D2000, D3000 and D3000m platforms.
Wide-temperature IC / Reliable Packaging / Edge Intelligence
High-reliability semiconductor solutions for critical systems.
Kangda IC provides wide-temperature memory, Ethernet PHY, AI modules, power devices, packaging, testing and screening services for industrial, power, automotive and high-reliability applications.
Domestic Control
High-Reliability IC
-55C to +125C
High Reliability
Domestic Supply
2003founded in Beijing
100+industry customer projects
IC + SiPchips and system packaging
Company
From high-reliability chip solutions to independently controlled product platforms.
Founded in 2003, Beijing Kangda Hengye Technology Development Co., Ltd. is headquartered in Zhongguancun, Haidian District, Beijing. Kangda serves customers in aerospace, energy, communications, university research and industrial control with high-reliability chip solutions and local technical support.
Kangda continues to invest in self-developed domestic chip products. Starting from memory products, the portfolio has expanded into DDR4, LPDDR4, LPDDR5, MRAM, PHY, eMMC, AI modules and SiP product lines.
Kangda focuses on stable long-term supply and engineering follow-through, supported by domestic packaging and test partners, in-house screening capability in Beijing, and sales plus technical-support teams for evaluation, documentation, sample introduction, mass supply and issue review.
Package Design
Testing & Screening
Wide-temp Validation
Domestic Replacement
Technical Support
Products
Product Center
Kangda's product portfolio covers wide-temperature memory, embedded storage, network interfaces, AI modules and power devices, supporting engineering discussions by platform, interface, capacity, package and supply lifecycle.
Platform Support
Engineering support for domestic controllers and FPGA platforms, from selection review to board-level design-in.
Kangda supports domestic CPU, AI SoC, GPU/display-controller, FPGA and embedded-controller platforms with product selection, documentation coordination and issue follow-up across memory, boot Flash, eMMC, PHY and AI modules.
Ascend
LPDDR, eMMC, module-level solution and wide-temperature design-in support for AI platforms such as 310B, 310P and 910C.
Rockchip
LPDDR4/LPDDR5, eMMC, AI-module and interface-device support for edge platforms such as RK3588.
Loongson
DDR3/DDR4 memory, boot storage and replacement review for platforms such as 3A3000 and 3A6000.
Jingjia Micro
Wide-temperature memory, Flash and high-speed interface-device matching for graphics, display, compute-acceleration and embedded-board designs.
Fudan Micro
Configuration Flash, DDR/LPDDR memory and peripheral-device selection support for FPGA, SoC FPGA and control platforms.
Guowei
Boot configuration, storage capacity, interface-device and supply-timeline matching for FPGA and dedicated controller platforms.
Zhaoxin
DDR, boot storage, eMMC and network-interface selection support for domestic x86 platforms and industrial computing boards.
Iluvatar CoreX
High-speed storage, boot Flash, interface-device and system design-in review for GPU acceleration and HPC boards.
Cambricon
LPDDR/eMMC, module-level solution and wide-temperature application review for AI inference and edge-intelligence platforms.
Reliability
Quality and high-reliability workflow
01SelectionMatch capacity, interface, package and temperature grade to the application.
02PackagingSupport package design, system-level integration and screening.
03ValidationBuild evidence for wide-temperature and high-reliability use cases.
04SupportProvide documents, selection advice and issue follow-up.
Applications
Application Areas
Industrial Control
PLCs, edge gateways, industrial displays and embedded boards.
Power Equipment
Protection systems, data acquisition terminals and long-running communication units.
Automotive Electronics
In-vehicle communication, domain-controller peripherals and wide-temperature storage.
High-Reliability Systems
Systems requiring secure supply, environmental robustness and quality traceability.
Contact
Tell us which products and support you need.
Overseas customers can submit contact details, product interests, application context and the help needed from sales or FAE.
Beijing Office
D407, Jinyu Jiahua Building, No. 9 Shangdi 3rd Street, Haidian District, Beijing, China
Tel: 010-62653133
Fax: 010-62652702
Xi'an Office
Room 2020, EVOC City Plaza, Jinye 1st Road, High-tech Zone, Xi'an, Shaanxi, China
Shenzhen Office
Block B, Garden City Digital Building, Nanshan District, Shenzhen, Guangdong, China