Volatile Memory
Volatile Memory
- SRAM
- SDRAM
- DDR1/2/3/4
- 3D PLUS
SRAM, SDRAM and DDR SDRAM products for processors, FPGAs, computer boards and data-processing chains.
Open Family
Official Agent / 3D Microelectronics / High Reliability
Kangda IC is an official agent for 3D PLUS.
Kangda IC supports selection, technical coordination, supply communication and local service for 3D PLUS high-density 3D microelectronic modules used in space, aerospace and other high-reliability electronic systems.
3D
PLUS
High-reliability 3D microelectronic modules
220k+modules in orbit, per 3D PLUS
25+ yrsflight heritage
Spacespace and aerospace positioning
3D PLUS
Introducing mature 3D microelectronic product lines for high-reliability systems.
The official 3D PLUS product portfolio covers memory, computer cores, interfaces, power, protection devices, camera heads and custom SiP solutions, presented here as a dedicated second-level product page on the Kangda website.
Product Matrix
3D PLUS Product Center
Organized from the official 3D PLUS product structure into local product-family entry pages. Customers can browse by application and device type, then open each product introduction and official source link.
Non-Volatile Memory
Non-Volatile Memory
- PROM/EEPROM
- MRAM
- NOR/NAND
- MNEMOSYNE
Products for boot, configuration, firmware, project data recording and power-loss retention.
Open Family
Fault-Tolerance & Mitigation IP
Fault-Tolerance & Mitigation IP
- RIMC
- RMIC
- Majority Voter
- Reed-Solomon
Controller, correction and majority-voter solutions shown separately from ordinary memory products.
Open Family
Interfaces
Interfaces
- LVDS
- LVT
- High-speed links
- Board I/O
High-speed differential links, low-voltage logic and board-level interconnect for system integration.
Open Family
Power & Protection
Power & Protection
- POL
- DDR VTT
- LCL
- Protection Switch
Products for FPGA, processor and memory rails, current isolation and power-path protection.
Open Family
Computer Core
Computer Core
- FUSIO RT
- COMBO
- FPGA config
- Boot manager
Reconfigurable computing, configuration memory and companion functions in compact 3D packages.
Open Family
Camera Heads
Camera Heads
- CASPEX
- IRIS
- ASTERIA
- SWIR
Camera heads and imaging systems presented as a dedicated imaging-product family.
Open Family
Industrial Memory
Industrial Memory
- Industrial DDR4
- Industrial DDR3
- NOR
- NAND
High-density 3D packaged memory products for demanding industrial environments.
Open Family
Custom SiP
Custom SiP
- Concept
- Feasibility
- Design
- Manufacturing
Project entry for concept analysis, feasibility study, design, manufacturing and test coordination.
Open Family
Agency Support
How Kangda IC supports 3D PLUS projects
01SelectionScreen product families by application scenario, interface, capacity, power and reliability requirements.
02DocumentsCoordinate public documents, technical parameters and next-step communication.
03SupplySupport project schedule, lead-time review and batch communication.
04Local SupportCombine 3D PLUS products with Kangda's own wide-temperature memory, AI modules and power devices where useful.
Contact
Need 3D PLUS selection or agency support?
Please share the application, target product family, approximate quantity, environmental requirements and project timeline.
Beijing Office
D407, Jinyu Jiahua Building, No. 9 Shangdi 3rd Street, Haidian District, Beijing, China
Tel: 010-62653133
Fax: 010-62652702
Xi'an Office
Room 2020, EVOC City Plaza, Jinye 1st Road, High-tech Zone, Xi'an, Shaanxi, China
Shenzhen Office
Block B, Garden City Digital Building, Nanshan District, Shenzhen, Guangdong, China