产品概述
FUSIO RT 集成 RHBD SRAM-based FPGA、128Mbit TMR 配置存储和可选外部存储。 FUSIO RT 与 COMBO 产品把可重构计算、配置存储和伴随功能集成到小型化封装。
产品条目4
ProductFUSIO RT BASIC / FUSIO RT NAND / FUSIO RT SDRAM / FUSIO RT FULL
料号数量4
Package483 balls BGA
Pitch 1.27mm
Temperature-40 °C to +105 °C
产品规格与订购信息
| Product | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| FUSIO RT BASIC | 3DMC0753 | Space computer core with embedded RHBD FPGA NX1H35AS and 128Mb TMR Flash NOR | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
| FUSIO RT NAND | 3DMC0754 | Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 64 Gb NAND Flash | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
| FUSIO RT SDRAM | 3DMC0755 | Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 2 Gb SDRAM | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
| FUSIO RT FULL | 3DMC0752 | Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR, 64 Gb NAND Flash and 2 Gb SDRAM | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
资料链接
- 查看 3D PLUS 产品页面
- Computer, Power and SiP Part Number Decoder
- 3DEV0753 : Development board for 3DMC0753 PDF - 1479 ko
- 3DEV0752 : Development board for 3DMC0752 PDF - 991 ko
- 3DEV0754 : Development board for 3DMC0754 PDF - 5845 ko
- 3DEV0755 : Development board for 3DMC0755 PDF - 993 ko
康达代理支持
- 根据产品系列、应用场景、接口、容量、供货周期协助初步选型。
- 协助整理应用背景、数量级、项目节点和资料需求，进入技术与商务沟通。
- 可结合康达自有宽温存储、AI 模块、电源器件提供组合方案建议。