Product Overview
Selection Positioning
KD3D4G16LABM is a 4Gb x16 DDR3L/DDR3 wide-temperature memory for legacy-platform continuation and replacement designs.
Density Organization256Mb x16, 4Gb total density
Interface StandardJEDEC JESD-79-3F DDR3
Power RailsDDR3L 1.35V, compatible with DDR3 1.5V mode
Package SizePBGA-96, approx. 13mm x 7.5mm
Speed RangeUp to 1866Mbps, backward-compatible to 800Mbps
Compatibility ReferenceMT41K256M16TW
Key Features
- Supports CK/CK# differential clock, programmable CL and CWL.
- 8-bank array with 8n prefetch; fixed BL8 with BC4 support.
- Supports self refresh and on-die termination; IBIS models can assist signal-integrity simulation.
Typical Applications
- Suitable for Fudan Micro FPGA platforms, Phytium FT2000, Loongson 3A3000 and similar systems.
- Used for DDR3 platform maintenance, replacement projects and wide-temperature operation.
Design-in Notes
- Confirm host processor, FPGA or SoC interface support, voltage rails and package footprint constraints.
- Before sample design-in, share schematic, PCB stack-up, clock/reset design, power sequencing and replacement part information.
- For replacement projects, provide the original part number, operating temperature, speed grade, package constraints and lifecycle requirement.
Selection Support
For platform compatibility, replacement review, temperature range, package constraints or document status, please submit the target platform, expected volume and project phase. Kangda sales and FAE teams can follow up with that context.