Product Overview
Selection Positioning
KD5D16G16LABM is an in-development DDR5 x16 high-speed memory option for early evaluation on next-generation processors and FPGA platforms.
Capacity / Width16Gb x16
Target Speed5600Mbps
Supply1.1V
PackagePBGA-106
Compatibility ReferenceMT60B1G16HD
Design-in StageSamples are available; document status can be confirmed by project timing
Key Features
- Suitable for early review of high-speed memory topology, power rails, training flow and thermal design.
- Schematic and PCB constraints can be reviewed around DDR5 x16 width, package and speed grade.
Typical Applications
- Next-generation high-bandwidth data processing, edge computing and domestic-platform pre-evaluation.
- Useful when sample needs, compatible part numbers and production timing must be locked early.
Design-in Notes
- Confirm host processor, FPGA or SoC interface support, voltage rails and package footprint constraints.
- Before sample design-in, share schematic, PCB stack-up, clock/reset design, power sequencing and replacement part information.
- For replacement projects, provide the original part number, operating temperature, speed grade, package constraints and lifecycle requirement.
Selection Support
For platform compatibility, replacement review, temperature range, package constraints or document status, please submit the target platform, expected volume and project phase. Kangda sales and FAE teams can follow up with that context.