Product Overview
Selection Positioning
KDL4D4GB32LBBM is a 32Gb x32 dual-channel LPDDR4/LPDDR4X wide-temperature memory for low-power, high-integration embedded platforms.
Density Organization32Gb, x32 width, dual-channel architecture
Interface StandardJEDEC JESD-209-4 LPDDR4
Power RailsVDD1=1.8V, VDD2/VDDQ=1.1V; LPDDR4X VDDQ=0.6V
Package SizePBGA-200, approx. 15mm x 10mm
Compatibility ReferenceMT53D512M32D2
Version NoteParameter-compatible with KDL4D4GB32LABM; internal die version differs
Key Features
- Supports 8 banks per channel, 16n prefetch, PASR partial-array self refresh and on-die temperature-sensor controlled refresh.
- Supports programmable RL/WL, programmable or real-time BL16/BL32 burst length and per-byte differential data strobes.
- Integrated CA training, write leveling and DQS training help simplify high-speed interface bring-up.
Typical Applications
- Suitable for platforms such as Rockchip RK3588, Ascend 310B/310P/910C and Phytium D3000m.
- Used in AI modules, edge-computing boards, low-power industrial SBCs and space-constrained system designs.
Design-in Notes
- Confirm host processor, FPGA or SoC interface support, voltage rails and package footprint constraints.
- Before sample design-in, share schematic, PCB stack-up, clock/reset design, power sequencing and replacement part information.
- For replacement projects, provide the original part number, operating temperature, speed grade, package constraints and lifecycle requirement.
Selection Support
For platform compatibility, replacement review, temperature range, package constraints or document status, please submit the target platform, expected volume and project phase. Kangda sales and FAE teams can follow up with that context.
KDL4D4GB32LABM
KDL4D8GB32LABM