Product Overview
Selection Positioning
KDL5D8GB32LABM is an x32 dual-channel LPDDR5 wide-temperature memory supporting LPDDR5/LPDDR5X operating modes for next-generation high-bandwidth, low-power platforms.
Density Organization8GB x32, x32 width, dual-channel I/O architecture
Interface StandardJEDEC JESD-209-5 LPDDR5/LPDDR5X
Power RailsVDD1=1.8V, VDD2H=1.05V, VDD2L=0.9V, VDDQ=0.5V
PackagePBGA-315, x32 315-ball BGA
Speed CapabilitySelection table lists 7500Mbps; interface capability can be reviewed with the target platform
StatusWide-temperature product
Key Features
- Supports bank-group mode, 16-bank mode, 16n prefetch, read/write parity and DBI.
- Supports Link Protection, configurable ODT and programmable output-drive strength.
- Command/address training and read/write calibration support high-bandwidth platform bring-up.
Typical Applications
- Next-generation edge computing, image processing, AI inference and high-bandwidth embedded platforms.
- Best reviewed early with package, power-rail, power-sequencing and PCB constraints.
Design-in Notes
- Confirm host processor, FPGA or SoC interface support, voltage rails and package footprint constraints.
- Before sample design-in, share schematic, PCB stack-up, clock/reset design, power sequencing and replacement part information.
- For replacement projects, provide the original part number, operating temperature, speed grade, package constraints and lifecycle requirement.
Selection Support
For platform compatibility, replacement review, temperature range, package constraints or document status, please submit the target platform, expected volume and project phase. Kangda sales and FAE teams can follow up with that context.
KDL5D12GB32LABM