Product Overview
Selection Positioning
KDST310PVS is an in-development AI module built around Ascend 310P, 176TOPS compute, 128GB eMMC + LPDDR4 storage and board-level connector integration.
Compute PlatformAscend 310P
Compute / Performance176TOPS compute
Memory / Storage128GB eMMC + LPDDR4
Supply12V
Package / ConnectorVPX connector
Project StatusIn development
Key Features
- Designed for edge inference, visual processing and industrial control, reducing customer effort on core compute-board design.
- Module design can be reviewed against system size, thermal design, power supply, OS image and interface expansion.
Typical Applications
- AI box, industrial vision controller, edge-computing node and robotic/vehicle perception compute platform.
- Early review should confirm compute requirement, OS/SDK, interface count, thermal design and production timing.
Design-in Notes
- Confirm host processor, FPGA or SoC interface support, voltage rails and package footprint constraints.
- Before sample design-in, share schematic, PCB stack-up, clock/reset design, power sequencing and replacement part information.
- For replacement projects, provide the original part number, operating temperature, speed grade, package constraints and lifecycle requirement.
Selection Support
For platform compatibility, replacement review, temperature range, package constraints or document status, please submit the target platform, expected volume and project phase. Kangda sales and FAE teams can follow up with that context.
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