3D PLUS / Computer Core

COMBO

COMBO combines configuration memory and boot manager functions for FPGA configuration paths.

COMBO
Overview

Product Overview

COMBO combines configuration memory and boot manager functions for FPGA configuration paths. FUSIO RT and COMBO products integrate reconfigurable computing, configuration memory and companion functions into compact packages.

Product entries1
ProductCOMBO
Part numbers1
Package483 balls BGA Pitch 1,27mm
Temperature-40 °C to +105 °C

Product Lineup

ProductPart NumberDescriptionPackageTemperature
COMBO3DMCO0849Space grade COnfiguration Memory BOot manager COMBO483 balls BGA
Pitch 1,27mm
-40 °C to +105 °C

Documents And Product Links

Kangda Support

  • Initial selection support by product family, application scenario, interface, capacity and supply timeline.
  • Inquiry preparation with application background, quantity range, project schedule and document needs.
  • Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.
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