Product Overview
FUSIO RT integrates an RHBD SRAM-based FPGA, 128Mbit TMR configuration memory and optional external memory. FUSIO RT and COMBO products integrate reconfigurable computing, configuration memory and companion functions into compact packages.
Product entries4
ProductFUSIO RT BASIC / FUSIO RT NAND / FUSIO RT SDRAM / FUSIO RT FULL
Part numbers4
Package483 balls BGA
Pitch 1.27mm
Temperature-40 °C to +105 °C
Product Lineup
| Product | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| FUSIO RT BASIC | 3DMC0753 | Space computer core with embedded RHBD FPGA NX1H35AS and 128Mb TMR Flash NOR | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
| FUSIO RT NAND | 3DMC0754 | Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 64 Gb NAND Flash | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
| FUSIO RT SDRAM | 3DMC0755 | Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 2 Gb SDRAM | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
| FUSIO RT FULL | 3DMC0752 | Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR, 64 Gb NAND Flash and 2 Gb SDRAM | 483 balls BGA Pitch 1.27mm | -40 °C to +105 °C |
Documents And Product Links
- Open 3D PLUS product page
- Computer, Power and SiP Part Number Decoder
- 3DEV0753 : Development board for 3DMC0753 PDF - 1479 ko
- 3DEV0752 : Development board for 3DMC0752 PDF - 991 ko
- 3DEV0754 : Development board for 3DMC0754 PDF - 5845 ko
- 3DEV0755 : Development board for 3DMC0755 PDF - 993 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.