Product Overview
DDR2 SDRAM for mature platforms, continuity programs and replacement review. SRAM, SDRAM and DDR SDRAM products for processors, FPGAs, computer boards and data-processing chains.
Product entries8
Density1 Gb / 2 Gb / 4 Gb / 6 Gb / 8 Gb
Part numbers8
PackageSOP 74 / BGA 295 / BGA 191 / BGA 143 / QPF 144 / SOP 88
Temperature-40 °C to +105 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 1 Gb | 3D2D1G08US1285 | 128M x8 667 MT/s | SOP 74 | -40 °C to +105 °C |
| 2 Gb | 3D2D2G08US2662 | 256M x8 533 MT/s | SOP 74 | -40 °C to +105 °C |
| 2 Gb | 3D2D2G16UB2684 | 128M x16 667 MT/s | BGA 295 | -40 °C to +105 °C |
| 4 Gb | 3D2D4G08US4661 | 512M x8 533 MT/s | SOP 74 | -40 °C to +105 °C |
| 4 Gb | 3D2D4G72UB3652 | 64M x72 667 MT/s | BGA 191 | -40 °C to +105 °C |
| 6 Gb | 3D2D6G48UB3687 | 128M x48 667 MT/s | BGA 143 | -40 °C to +105 °C |
| 6 Gb | 3D2D6G48UQ3694 | 128M x48 533 MT/s | QPF 144 | -40 °C to +105 °C |
| 8 Gb | 3D2D8G08US8663 | 1G x8 533 MT/s | SOP 88 | -40 °C to +105 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3D2D1G08US1285 - Assembly Recommendations PDF - 805 ko
- 3D2D1G08US1285 - Footprint PDF - 289 ko
- 3D2D2G08US2662 - Assembly Recommendations PDF - 805 ko
- 3D2D2G08US2662 - Footprint PDF - 271 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.