Product Overview
SDRAM products for legacy computer boards, processors and FPGA data buffers. SRAM, SDRAM and DDR SDRAM products for processors, FPGAs, computer boards and data-processing chains.
Product entries14
Density512 Mb / 1 Gb / 1.5 Gb / 2 Gb / 2.5 Gb / 3 Gb / 4 Gb
Part numbers14
PackageSOP 54 / SOP 58 / SOP54 / SOP 70 / BGA 215 / BGA 119 / QFP 114 / SOP 62
Temperature-40 °C to +105 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 512 Mb | 3DSD512M16VS1605 | 32M x16 133 MT/s | SOP 54 | -40 °C to +105 °C |
| 1 Gb | 3DSD1G08VS2685 | 128M x8 133 MT/s | SOP 54 | -40 °C to +105 °C |
| 1 Gb | 3DSD1G16VS2494 | 64M x16 133 MT/s | SOP 58 | -40 °C to +105 °C |
| 1 Gb | 3DSD1G16VS2620 | 64M x16 133 MT/s | SOP54 | -40 °C to +105 °C |
| 1 Gb | 3DSD1G32VS2490 | 32M x32 133 MT/s | SOP 70 | -40 °C to +105 °C |
| 1.5 Gb | 3DSD1G48VB2820 | 32M x48 133 MT/s | BGA 215 | -40 °C to +105 °C |
| 2 Gb | 3DSD2G08VS4686 | 256M x8 133 MT/s | SOP 54 | -40 °C to +105 °C |
| 2 Gb | 3DSD2G16VS4767 | 128M x16 133 MT/s | SOP 54 | -40 °C to +105 °C |
| 2 Gb | 3DSD2G32VS4484 | 64M x32 133 MT/s | SOP 70 | -40 °C to +105 °C |
| 2 Gb | 3DSD2G64VB4488 | 32M x64 133 MT/s | BGA 119 | -40 °C to +105 °C |
| 2.5 Gb | 3DSD2G40VS5493 | 64M x40 133 MT/s | SOP 70 | -40 °C to +105 °C |
| 3 Gb | 3DSD3G48VQ6486 | 64M x48 133 MT/s | QFP 114 | -40 °C to +105 °C |
| 4 Gb | 3DSD4G08VS8613 | 512M x8 133 MT/s | SOP 58 | -40 °C to +105 °C |
| 4 Gb | 3DSD4G16VS8483 | 256M x16 133 MT/s | SOP 62 | -40 °C to +105 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3DSD512M16VS1605 - Assembly Recommendations PDF - 805 ko
- 3DSD512M16VS1605 - Footprint PDF - 275 ko
- 3DSD1G08VS2685 - Assembly Recommendations PDF - 805 ko
- 3DSD1G08VS2685 - Footprint PDF - 275 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.