Product Overview
High-reliability SRAM for processor peripherals, cache and control logic. SRAM, SDRAM and DDR SDRAM products for processors, FPGAs, computer boards and data-processing chains.
Product entries15
Density4 Mb / 8 Mb / 16 Mb / 20 Mb / 32 Mb
Part numbers15
PackageSOP 44 / SOP 54 / SOP 64 / SOP 84 / SOP 68
Temperature-55 °C to +125 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 4 Mb | 3DSR4M08VS1520 | 512K x8 12 ns, 3.3 V | SOP 44 | -55 °C to +125 °C |
| 4 Mb | 3DSR4M16VS1690 | 256K x16 12 ns, 3.3 V | SOP 44 | -55 °C to +125 °C |
| 4 Mb | 3DSR4M08CS1647 | 512K x8 12 ns, 5.0 V | SOP 44 | -55 °C to +125 °C |
| 8 Mb | 3DSR8M16VS2505 | 512K x16 12 ns, 3.3 V | SOP 54 | -55 °C to +125 °C |
| 8 Mb | 3DSR8M16CS2510 | 512K x16 12 ns, 5.0 V | SOP 54 | -55 °C to +125 °C |
| 8 Mb | 3DSR8M32VS2503 | 256K x32 12 ns, 3.3 V | SOP 64 | -55 °C to +125 °C |
| 16 Mb | 3DSR16M08CS4660 | 2M x8 12 ns, 5.0 V | SOP 44 | -55 °C to +125 °C |
| 16 Mb | 3DSR16M16VS4502 | 1M x16 12 ns, 3.3 V | SOP 54 | -55 °C to +125 °C |
| 16 Mb | 3DSR16M16CS4512 | 1M x16 12 ns, 5.0 V | SOP 54 | -55 °C to +125 °C |
| 16 Mb | 3DSR16M32VS4500 | 512K x32 12 ns, 3.3 V | SOP 64 | -55 °C to +125 °C |
| 16 Mb | 3DSR16M32CS4511 | 512K x32 12 ns, 5.0 V | SOP 64 | -55 °C to +125 °C |
| 20 Mb | 3DSR20M40VS2708 | 512K x40 12 ns, 3.3 V | SOP 84 | -55 °C to +125 °C |
| 32 Mb | 3DSR32M16VS8506 | 2M x16 12 ns, 3.3 V | SOP 54 | -55 °C to +125 °C |
| 32 Mb | 3DSR32M32VS8504 | 1M x32 12 ns, 3.3 V | SOP 68 | -55 °C to +125 °C |
| 32 Mb | 3DSR32M32VS8501 | 1M x32 12 ns, 3.3 V | SOP 68 | -55 °C to +125 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3DSR4M08VS1520 - Assembly Recommendations PDF - 805 ko
- 3DSR4M08VS1520 - Footprint PDF - 248 ko
- 3DSR4M16VS1690 - Assembly Recommendations PDF - 805 ko
- 3DSR4M16VS1690 - Footprint PDF - 266 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.