Product Overview
DDR4 SDRAM covers 16Gb to 64Gb, with 1.2V operation, BGA packaging, high speed and board-area-saving positioning. SRAM, SDRAM and DDR SDRAM products for processors, FPGAs, computer boards and data-processing chains.
Product entries5
Density64 Gb / 48 Gb / 32 Gb / 24 Gb / 16 Gb
Part numbers5
PackageBGA 363 / BGA 259
Temperature-55 °C to +105 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 64 Gb | 3D4D64G80LB2860 | 1G x80 2400 MT/s | BGA 363 | -55 °C to +105 °C |
| 48 Gb | 3D4D48G48LB2825 | 1G x48 2400 MT/s | BGA 259 | -55 °C to +105 °C |
| 32 Gb | 3D4D32G72LB2805 | 512M x72 2400 MT/s | BGA 259 | -55 °C to +105 °C |
| 24 Gb | 3D4D24G48LB2833 | 512M x48 2400 MT/s | BGA 259 | -55 °C to +105 °C |
| 16 Gb | 3D4D16G72LB2832 | 256M x72 2400 MT/s | BGA 259 | -55 °C to +105 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3D4D16G72LB2832 - Assembly Recommendations PDF - 1452 ko
- 3D4D16G72LB2832 - Footprint PDF - 1875 ko
- 3D4D24G48LB2833 - Assembly Recommendations PDF - 1452 ko
- 3D4D24G48LB2833 - Footprint PDF - 1862 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.