Product Overview
EEPROM for parameters, calibration data and small non-volatile records. PROM, EEPROM, MRAM, NOR, SPI NOR, NAND, RTIMS Flash and MNEMOSYNE products for boot, configuration and data retention.
Product entries7
Density1 Mb / 2 Mb / 4 Mb / 5 Mb / 8 Mb
Part numbers7
PackageSOP 40 / SOP 60
Temperature-55 °C to +125 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 1 Mb | 3DEE1M08VS1192 | 128K x8 250 ns access time | SOP 40 | -55 °C to +125 °C |
| 2 Mb | 3DEE2M08VS2154 | 256K x16 250 ns access time | SOP 40 | -55 °C to +125 °C |
| 4 Mb | 3DEE4M08VS4145 | 512K x8 250 ns access time | SOP 40 | -55 °C to +125 °C |
| 4 Mb | 3DEE4M32VS4162 | 128K x8 250 ns access time | SOP 40 | -55 °C to +125 °C |
| 5 Mb | 3DEE5M40VS5257 | 128K x40 250 ns access time | SOP 40 | -55 °C to +125 °C |
| 8 Mb | 3DEE8M08VS8190 | 1M x8 250 ns access time | SOP 40 | -55 °C to +125 °C |
| 8 Mb | 3DEE8M32VS8094 | 256K x32 250 ns access time | SOP 60 | -55 °C to +125 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3DEE1M08VS1192- Assembly Recommendations PDF - 805 ko
- 3DEE1M08VS1192- Footprint PDF - 237 ko
- 3DEE2M08VS2154 - Asembly Recommendations PDF - 805 ko
- 3DEE2M08VS2154 - Footprint PDF - 262 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.