Product Overview
PROM for boot, configuration and read-only program storage. PROM, EEPROM, MRAM, NOR, SPI NOR, NAND, RTIMS Flash and MNEMOSYNE products for boot, configuration and data retention.
Product entries3
Density32 Mb / 64 Mb / 128 Mb
Part numbers3
PackageSOP 44
Temperature-55 °C to +125 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 32 Mb | 3DPO32M08VS1419 | 4M x8 Clock rate: 20 MHz | SOP 44 | -55 °C to +125 °C |
| 64 Mb | 3DPO64M08VS2299 | 8M x8 Clock rate: 20 MHz | SOP 44 | -55 °C to +125 °C |
| 128 Mb | 3DPO128M08VS4667 | 16M x8 Clock rate: 20 MHz | SOP 44 | -55 °C to +125 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3D2D1G08US1285 - Assembly Recommendations PDF - 805 ko
- 3DPO32M08VS1419 - Footprint PDF - 266 ko
- 3DPO64M08VS2299 - Assembly Recommendations PDF - 805 ko
- 3DPO64M08VS2299 - Footprint PDF - 270 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.