Product Overview
MRAM for fast writes and power-loss retention. PROM, EEPROM, MRAM, NOR, SPI NOR, NAND, RTIMS Flash and MNEMOSYNE products for boot, configuration and data retention.
Product entries7
Density1 Mb / 2 Mb / 4 Mb / 8 Mb / 10 Mb / 64 Mb
Part numbers7
PackageSOP 44 / SOP 54 / SOP 68 / SOP 96
Temperature-55 °C to +105 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 1 Mb | 3DMR1M08VS1426 | 128K x8 40 ns access time | SOP 44 | -55 °C to +105 °C |
| 2 Mb | 3DMR2M16VS2427 | 128K x16 40 ns access time | SOP 54 | -55 °C to +105 °C |
| 4 Mb | 3DMR4M08VS4428 | 512K x8 40 ns access time | SOP 44 | -55 °C to +105 °C |
| 8 Mb | 3DMR8M08VS8666 | 1M x8 40 ns access time | SOP 44 | -55 °C to +105 °C |
| 8 Mb | 3DMR8M32VS8420 | 256K x32 40 ns access time | SOP 68 | -55 °C to +105 °C |
| 10 Mb | 3DMR10M40VS5688 | 256K x40 40 ns access time | SOP 96 | -55 °C to +105 °C |
| 64 Mb | 3DMR64M08VS4476 | 8M x8 40 ns access time | SOP 54 | -55 °C to +105 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3DMR1M08VS1426 - Assembly Recommendations PDF - 805 ko
- 3DMR1M08VS1426 - Footprint PDF - 266 ko
- 3DMR2M16VS2427 - Assembly Recommendations PDF - 805 ko
- 3DMR2M16VS2427 - Footprint PDF - 275 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.