Product Overview
NOR Flash for boot code, program storage and reliable configuration. PROM, EEPROM, MRAM, NOR, SPI NOR, NAND, RTIMS Flash and MNEMOSYNE products for boot, configuration and data retention.
Product entries7
Density64 Mb / 128 Mb / 256 Mb / 512 Mb / 2 Gb
Part numbers7
PackageSOP 54 / SOP 56 / SOP 60
Temperature-55 °C to +125 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 64 Mb | 3DFO64M16VS1281 | 4M x16 90 ns access time | SOP 54 | -55 °C to +125 °C |
| 128 Mb | 3DFO128M16VS2282 | 8M x16 90 ns access time | SOP 54 | -55 °C to +125 °C |
| 256 Mb | 3DFO256M16VS4105 | 16M x16 90 ns access time | SOP 54 | -55 °C to +125 °C |
| 256 Mb | 3DFO256M16VS4269 | 16M x16 90 ns access time | SOP 54 | -55 °C to +125 °C |
| 512 Mb | 3DFO512M16VS8492 | 32M x16 90 ns access time | SOP 56 | -55 °C to +125 °C |
| 2 Gb | 3DFO2G16VS4214 | 128M x16 100 ns access time | SOP 60 | -55 °C to +125 °C |
| 2 Gb | 3DFO2G08VS4215 | 256M x8 110 ns access time | SOP 60 | -55 °C to +125 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- Assembly Recommendations PDF - 805 ko
- Footprint PDF - 268 ko
- Asembly Recommendations PDF - 805 ko
- Footprint PDF - 271 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.