Product Overview
High-density NAND Flash for mass storage and project data recording. PROM, EEPROM, MRAM, NOR, SPI NOR, NAND, RTIMS Flash and MNEMOSYNE products for boot, configuration and data retention.
Product entries2
Density4 Tb / 8 Tb
Part numbers2
PackageBGA 215
Temperature-40 °C to +105 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 4 Tb | 3DFN4T16LB1862 | 512G x8 Asynchronous/Synchronous | BGA 215 | -40 °C to +105 °C |
| 8 Tb | 3DFN8T16LB2821 | 1024G x8 Asynchronous/Synchronous | BGA 215 | -40 °C to +105 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3DFN4T16LB1862 - Assembly Recommendations PDF - 988 ko
- 3DFN4T16LB1862 - Footprint PDF - 701 ko
- 3DFN8T16LB2821 - Assembly Recommendations PDF - 988 ko
- 3DFN8T16LB2821 - Footprint PDF - 702 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.