Product Overview
MNEMOSYNE is a high-reliability non-volatile memory product entry from 3D PLUS. PROM, EEPROM, MRAM, NOR, SPI NOR, NAND, RTIMS Flash and MNEMOSYNE products for boot, configuration and data retention.
Product entries5
Density128 Mb / 512 Mb / 1 Gb
Part numbers5
PackageSOP 54 / SOP 42
Temperature-55 °C to +125 °C
Product Lineup
| Density | Part Number | Description | Package | Temperature |
|---|---|---|---|---|
| 128 Mb | 3DMN128M08VS1852 | 3.3 V parallel interface | SOP 54 | -55 °C to +125 °C |
| 512 Mb | 3DMN512M08US4853 | Up to 100 MHz 1.8 V SPI interface | SOP 42 | -55 °C to +125 °C |
| 512 Mb | 3DMN512M04VS4867 | Up to 25 MHz 3.3 V SPI interface | SOP 42 | -55 °C to +125 °C |
| 1 Gb | 3DMN1G08US8854 | Up to 100 MHz 1.8 V SPI interface | SOP 42 | -55 °C to +125 °C |
| 1 Gb | 3DMN1G04VS8868 | Up to 25 MHz 3.3 V SPI interface | SOP 42 | -55 °C to +125 °C |
Documents And Product Links
- Open 3D PLUS product page
- Memory Part Number Decoder
- 3DMN128M08VS1852 - Assembly Recommendations PDF - 805 ko
- 3DMN128M08VS1852 - Footprint PDF - 689 ko
- 3DMN512M08US4853 - Assembly Recommendations PDF - 805 ko
- 3DMN512M08US4853- Footprint PDF - 856 ko
Kangda Support
- Initial selection support by product family, application scenario, interface, capacity and supply timeline.
- Inquiry preparation with application background, quantity range, project schedule and document needs.
- Combination review with Kangda wide-temperature memory, AI modules and power devices where useful.